Inventor · disambiguated record
Beomseok Choi
Also filed as: CHOI BEOMSEOK
14 granted patents·17 pending applications·7 citations·filing 2017–2024
84Inventor score
Top patents by PatentIndex Score
31 records- 0192US12288750B2Conformal power delivery structure for direct chip attach architecturesINTEL CORP·Filed 2021·Granted Apr 29, 2025·2 cites·25 claims
- 0292US12074514B2Two stage multi-input multi-output regulatorINTEL CORP·Filed 2020·Granted Aug 27, 2024·3 cites·21 claims
- 0384US12266840B2Waveguide interconnects for semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Apr 1, 2025·1 cites·22 claims
- 0474US2024355725A1Power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0574US2025040231A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2024·Application pending·0 cites
- 0666US12100541B2Embedded cooling channel in magneticsINTEL CORP·Filed 2020·Granted Sep 24, 2024·0 cites·28 claims
- 0766US11380652B2Multi-level distributed clampsINTEL CORP·Filed 2017·Granted Jul 5, 2022·1 cites·15 claims
- 0864US12148747B2Gallium nitride (GAN) three-dimensional integrated circuit technologyINTEL CORP·Filed 2020·Granted Nov 19, 2024·0 cites·21 claims
- 0962US12087682B2Power delivery structuresINTEL CORP·Filed 2020·Granted Sep 10, 2024·0 cites·25 claims
- 1058US12424589B2Contiguous shield structures in microelectronic assemblies having hybrid bondingINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·16 claims
- 1156US12242290B2Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architecturesINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 1255US12170244B2High-throughput additively manufactured power delivery vias and tracesINTEL CORP·Filed 2020·Granted Dec 17, 2024·0 cites·17 claims
- 1355US2025104911A1Coaxial metal inductor loops and associated methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1454US2024063133A1Split metallization layers in multichip devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1554US2024186270A1Microelectronic assembly having antiferromagnetic film structure thereinINTEL CORP·Filed 2022·Application pending·0 cites
- 1653US2024063183A1Modular package architecture for voltage regulator-compute-memory circuits with quasi-monolithic chip layersINTEL CORP·Filed 2022·Application pending·0 cites
- 1752US2024113000A1Dual sided embedded passives via panel level thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2024114622A1Embedded passives with cavity sidewall interconnect in glass core architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1950US2023095608A1Conformal power delivery structures including embedded passive devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 2050US2023207492A1Coaxial inductor with plated high resistivity and high permeability magnetic materialALEKSOV ALEKSANDAR·Filed 2021·Application pending·0 cites
- 2150US2023095654A1Conformal power delivery structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 2249US2022415854A1Apparatus and method to integrate three-dimensional passive components between diesDOGIAMIS GEORGIOS·Filed 2021·Application pending·0 cites
- 2348US11353900B2Integrated cross-domain power transfer voltage regulatorsINTEL CORP·Filed 2018·Granted Jun 7, 2022·0 cites·19 claims
- 2446US2022085143A1Magnetic wires and their applicationsINTEL CORP·Filed 2020·Application pending·0 cites
- 2546US2022084736A1Tandem magnetics in packageINTEL CORP·Filed 2020·Application pending·0 cites
- 2645US11211866B2Reconfigurable inductorINTEL CORP·Filed 2017·Granted Dec 28, 2021·0 cites·23 claims
- 2745US2022102344A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2020·Application pending·0 cites
- 2844US2022085142A1Modular coupled magnetic voltage regulatorsINTEL CORP·Filed 2020·Application pending·0 cites
- 2941US11527489B2Apparatus and system with package stiffening magnetic inductor core and methods of making the sameINTEL CORP·Filed 2018·Granted Dec 13, 2022·0 cites·17 claims
- 3039US11710720B2Integrated multi-die partitioned voltage regulatorINTEL CORP·Filed 2018·Granted Jul 25, 2023·0 cites·20 claims
- 3139US2020006305A1Integrated heterogenous power management circuitriesINTEL CORP·Filed 2018·Application pending·0 cites
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