Inventor · disambiguated record
Benjamin Stassen Cook
Also filed as: COOK BENJAMIN · COOK BENJAMIN S · COOK BENJAMIN STASSEN
169 granted patents·39 pending applications·928 citations·filing 2014–2025
99Inventor score
Files withTEXAS INSTRUMENTS INC208
Top patents by PatentIndex Score
208 records- 0199US10461810B2Launch topology for field confined near field communication systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 29, 2019·112 cites·20 claims
- 0299US10425793B2Staggered back-to-back launch topology with diagonal waveguides for field confined near field communication systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 24, 2019·113 cites·20 claims
- 0399US10389410B2Integrated artificial magnetic launch surface for near field communication systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 20, 2019·115 cites·18 claims
- 0499US10171578B1Tapered coax launch structure for a near field communication systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 1, 2019·114 cites·27 claims
- 0598US11195811B2Dielectric and metallic nanowire bond layersTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 7, 2021·7 cites·16 claims
- 0698US10908414B2Lens cleaning via electrowettingTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 2, 2021·17 cites·24 claims
- 0798US10027376B2Guided near field communication for short range data communicationTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 17, 2018·114 cites·15 claims
- 0897US9529334B2Rotational transition based clock, rotational spectroscopy cell, and method of making sameTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 27, 2016·36 cites·15 claims
- 0996US9865537B1Methods and apparatus for integrated circuit failsafe fuse package with arc arrestTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 9, 2018·18 cites·15 claims
- 1096US9793214B1Heterostructure interconnects for high frequency applicationsTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 17, 2017·18 cites·20 claims
- 1196US9761543B1Integrated circuits with thermal isolation and temperature regulationTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 12, 2017·27 cites·20 claims
- 1296US9419075B1Wafer substrate removalTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 16, 2016·24 cites·11 claims
- 1395US9929110B1Integrated circuit wave device and methodTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 27, 2018·15 cites·21 claims
- 1495US9896330B2Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 1595US9590699B1Guided near field communication for short range data communicationTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 7, 2017·12 cites·2 claims
- 1693US12176298B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 24, 2024·2 cites·27 claims
- 1793US11693235B2Lens cleaning via electrowettingTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 4, 2023·2 cites·15 claims
- 1893US10748999B2Multi-super lattice for switchable arraysTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 18, 2020·6 cites·20 claims
- 1991US11390527B2Multi-layered SP2-bonded carbon tubesTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 19, 2022·3 cites·20 claims
- 2091US10131115B1Hermetically sealed molecular spectroscopy cell with dual wafer bondingTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 20, 2018·7 cites·22 claims
- 2190US2025066526A1Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2288US10861796B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 8, 2020·4 cites·8 claims
- 2388US10801985B2Sensing capacitor with a permeable electrodeTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 13, 2020·5 cites·15 claims
- 2488US10233074B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 19, 2019·4 cites·17 claims
- 2588US10121847B2Galvanic isolation deviceTEXAS INSTRUMENTS INC·Filed 2017·Granted Nov 6, 2018·5 cites·15 claims
- 2688US10032850B2Semiconductor die with back-side integrated inductive componentTEXAS INSTRUMENTS INC·Filed 2016·Granted Jul 24, 2018·4 cites·14 claims
- 2788US9865527B1Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulationTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 9, 2018·5 cites·20 claims
- 2887US11282807B2Nanowires plated on nanoparticlesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 22, 2022·2 cites·30 claims
- 2986US11865773B2Additive process for circular printing of electronic devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 9, 2024·3 cites·24 claims
- 3086US11854933B2Thermally conductive wafer layerTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·1 cites·17 claims
- 3186US10910465B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 2, 2021·3 cites·14 claims
- 3286US9646906B2Semiconductor package with printed sensorTEXAS INSTRUMENTS INC·Filed 2015·Granted May 9, 2017·5 cites·14 claims
- 3386US9524926B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·4 cites·3 claims
- 3485US12054385B2Stress isolation using three-dimensional trenchesTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 6, 2024·1 cites·18 claims
- 3585US10775422B2Molecular spectroscopy cell with resonant cavityTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 15, 2020·2 cites·8 claims
- 3685US10256188B2Interconnect via with grown graphitic materialTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 9, 2019·3 cites·16 claims
- 3785US9601820B2Dielectric waveguide comprised of a core surrounded by a cladding and forming integrated periodical structuresTEXAS INSTRUMENTS INC·Filed 2014·Granted Mar 21, 2017·5 cites·15 claims
- 3884US12139569B2Filler particles for polymersTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·16 claims
- 3984US10780467B2Methods and apparatus for surface wetting controlTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 22, 2020·3 cites·15 claims
- 4084US10424523B2Hermetically sealed molecular spectroscopy cell with buried ground planeTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 24, 2019·4 cites·10 claims
- 4184US9780017B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·3 cites·20 claims
- 4283US12457756B23D printed semiconductor packageTEXAS INSTRUMENTS INC·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 4383US11145598B2Lattice bump interconnectTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 12, 2021·3 cites·18 claims
- 4483US10804201B2Dissimilar material interface having latticesTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 13, 2020·3 cites·19 claims
- 4583US10498001B2Launch structures for a hermetically sealed cavityTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 3, 2019·3 cites·14 claims
- 4682US11498831B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 15, 2022·1 cites·7 claims
- 4782US10723616B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·2 cites·19 claims
- 4882US9659844B2Semiconductor die substrate with integral heat sinkTEXAS INSTRUMENTS INC·Filed 2015·Granted May 23, 2017·4 cites·24 claims
- 4981US12046430B2Liquid metal MEMS switchTEXAS INSTRUMENTS INC·Filed 2023·Granted Jul 23, 2024·0 cites·15 claims
- 5081US11128345B2Contactless interface for mm-wave near field communicationTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 21, 2021·1 cites·4 claims
Showing the top 50 of 208 patent records by PatentIndex Score.
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