Inventor · disambiguated record
Berit Freudenberg
Also filed as: FREUDENBERG BERIT
1 granted patent·1 pending application·13 citations·filing 2007–2007
35Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0180US7745327B2Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regimeADVANCED MICRO DEVICES INC·Filed 2007·Granted Jun 29, 2010·13 cites·18 claims
- 0233US2008206986A1Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regimePREUSSE AXEL·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →