Inventor · disambiguated record
Bernard Gorowitz
Also filed as: GOROWITZ BERNARD · LUPINSKI JOHN H
28 granted patents·2,183 citations·filing 1976–1999
98Inventor score
Top patents by PatentIndex Score
28 records- 0198US5527741AFabrication and structures of circuit modules with flexible interconnect layersMARTIN MARIETTA CORP·Filed 1994·Granted Jun 18, 1996·351 cites·13 claims
- 0298US5257496ACombustion control for producing low NOx emissions through use of flame spectroscopyGEN ELECTRIC·Filed 1992·Granted Nov 2, 1993·114 cites·50 claims
- 0397US5366906AWafer level integration and testingMARTIN MARIETTA CORP·Filed 1992·Granted Nov 22, 1994·196 cites·13 claims
- 0495US6298551B1Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areasGEN ELECTRIC·Filed 1999·Granted Oct 9, 2001·79 cites·14 claims
- 0595US5757072AStructure for protecting air bridges on semiconductor chips from damageMARTIN MARIETTA CORP·Filed 1996·Granted May 26, 1998·169 cites·9 claims
- 0694US5857858ADemountable and repairable low pitch interconnect for stacked multichip modulesGEN ELECTRIC·Filed 1996·Granted Jan 12, 1999·170 cites·25 claims
- 0793US5736448AFabrication method for thin film capacitorsGEN ELECTRIC·Filed 1995·Granted Apr 7, 1998·142 cites·7 claims
- 0892US5524339AMethod for protecting gallium arsenide mmic air bridge structuresMARTIN MARIETTA CORP·Filed 1994·Granted Jun 11, 1996·141 cites·11 claims
- 0992US5303684ACombustion control for producing low NOx emissions through use of flame spectroscopyGEN ELECTRIC·Filed 1993·Granted Apr 19, 1994·61 cites·16 claims
- 1090US5657537AMethod for fabricating a stack of two dimensional circuit modulesGEN ELECTRIC·Filed 1995·Granted Aug 19, 1997·102 cites·6 claims
- 1190US4998151APower field effect devices having small cell size and low contact resistanceGEN ELECTRIC·Filed 1989·Granted Mar 5, 1991·71 cites·14 claims
- 1288US5576925AFlexible multilayer thin film capacitorsGEN ELECTRIC·Filed 1994·Granted Nov 19, 1996·72 cites·18 claims
- 1384US4522681AMethod for tapered dry etchingGEN ELECTRIC·Filed 1984·Granted Jun 11, 1985·52 cites·11 claims
- 1482US5699234AStacking of three dimensional high density interconnect modules with metal edge contactsGEN ELECTRIC·Filed 1997·Granted Dec 16, 1997·57 cites·4 claims
- 1582US5391516AMethod for enhancement of semiconductor device contact padsMARTIN MARIETTA CORP·Filed 1991·Granted Feb 21, 1995·71 cites·11 claims
- 1681US5561085AStructure for protecting air bridges on semiconductor chips from damageMARTIN MARIETTA CORP·Filed 1994·Granted Oct 1, 1996·56 cites·8 claims
- 1777US4444618AProcesses and gas mixtures for the reactive ion etching of aluminum and aluminum alloysGEN ELECTRIC·Filed 1983·Granted Apr 24, 1984·38 cites·21 claims
- 1876US5973908AStructure for thin film capacitorsGEN ELECTRIC·Filed 1997·Granted Oct 26, 1999·42 cites·5 claims
- 1975US4824802AMethod of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structuresGEN ELECTRIC·Filed 1987·Granted Apr 25, 1989·42 cites·8 claims
- 2074US4845050AMethod of making mo/tiw or w/tiw ohmic contacts to siliconGEN ELECTRIC·Filed 1987·Granted Jul 4, 1989·43 cites·11 claims
- 2171US5401687AProcess for high density interconnection of substrates and integrated circuit chips containing sensitive structuresMARTIN MARIETTA CORP·Filed 1993·Granted Mar 28, 1995·43 cites·30 claims
- 2262US4074006APowder coatable polyester composition and electrical conductor coated therewithGEN ELECTRIC·Filed 1976·Granted Feb 14, 1978·10 cites·18 claims
- 2359US4100883AApparatus for electrostatic deposition on a running conductorGEN ELECTRIC·Filed 1976·Granted Jul 18, 1978·15 cites·6 claims
- 2458US4188413AElectrostatic-fluidized bed coating of wireGEN ELECTRIC·Filed 1978·Granted Feb 12, 1980·13 cites·24 claims
- 2548US4871617AOhmic contacts and interconnects to silicon and method of making sameGEN ELECTRIC·Filed 1984·Granted Oct 3, 1989·12 cites·10 claims
- 2643US4271783AApparatus for fluidized bed-electrostatic coating of indefinite length substrateGEN ELECTRIC·Filed 1979·Granted Jun 9, 1981·6 cites·12 claims
- 2741US4933742AMetallization contact system for large scale integrated circuitsGEN ELECTRIC·Filed 1988·Granted Jun 12, 1990·10 cites·21 claims
- 2833US5279706AMethod and apparatus for fabricating a metal interconnection pattern for an integrated circuit moduleGEN ELECTRIC·Filed 1992·Granted Jan 18, 1994·5 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →