Inventor · disambiguated record
Benjamin Alexander Haag
Also filed as: HAAG BENJAMIN · HAAG BENJAMIN ALEXANDER
4 granted patents·1 pending application·5 citations·filing 2015–2018
61Inventor score
Top patents by PatentIndex Score
5 records- 0185US10190028B2Epoxy two-part formulationsDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Jan 29, 2019·3 cites·2 claims
- 0281US10815405B2One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Granted Oct 27, 2020·2 cites·11 claims
- 0347US11739241B2High temperature epoxy adhesive formulationsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Aug 29, 2023·0 cites·7 claims
- 0447US2020140727A1Two-component room temperature curable toughened epoxy adhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Application pending·0 cites
- 0537US10435600B2Epoxy resin compositions for pre-gel ovensDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Oct 8, 2019·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →