Inventor · disambiguated record
Beng Yeung Ho
Also filed as: HO BENG YEUNG
6 granted patents·19 citations·filing 2013–2018
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0190US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0285US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 0376US9570314B2Methods for singulating semiconductor waferUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 14, 2017·3 cites·20 claims
- 0469US9240362B2Layer arrangement and a wafer level package comprising the layer arrangementAGENCY SCIENCE TECH & RES·Filed 2013·Granted Jan 19, 2016·3 cites·20 claims
- 0555US10354934B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 0646US9741619B2Methods for singulating semiconductor waferUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 22, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →