Inventor · disambiguated record
Benjamin Holzner
Also filed as: HOLZNER BENJAMIN
2 granted patents·2 citations·filing 2018–2021
34Inventor score
Top patents by PatentIndex Score
2 records- 0163US11152243B2Device for aligning and optically inspecting a semiconductor componentMUEHLBAUER GMBH & CO KG·Filed 2018·Granted Oct 19, 2021·2 cites·14 claims
- 0236US12308340B2Thermocompression apparatus and method for bonding electrical components to a substrateMB AUTOMATION GMBH & CO KG·Filed 2021·Granted May 20, 2025·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →