Inventor · disambiguated record
Benxia Huang
Also filed as: Huang Benxia
35 granted patents·34 pending applications·6 citations·filing 2020–2025
93Inventor score
Files withZHUHAI ACCESS SEMICONDUCTOR CO LTD63ZHUHAI YUEXIN SEMICONDUCTOR LLC3NANTONG ACCESS SEMICONDUCTOR CO LTD2UNIV ELECTRONIC SCI & TECH CHINA1
Top patents by PatentIndex Score
69 records- 0192US11114310B1Embedded packaging method capable of realizing heat dissipationZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 7, 2021·4 cites·7 claims
- 0291US12302508B2Temporary carrier and method for manufacturing coreless substrate therebyZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 13, 2025·2 cites·8 claims
- 0372US11769733B2Package substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·3 claims
- 0471US2025329629A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0570US12148676B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·9 claims
- 0670US12040272B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·13 claims
- 0770US11822121B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 21, 2023·0 cites·7 claims
- 0868US2025212337A1Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0966US11682621B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·6 claims
- 1065US12279377B2Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·7 claims
- 1164US12412843B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·5 claims
- 1264US12230581B2Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·12 claims
- 1364US11503712B2Passive device packaging structure embedded in glass medium and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 1464US11399440B2Method for manufacturing coreless substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·6 claims
- 1564US2025149461A1Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 1663US11515258B2Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 1762US11854920B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·9 claims
- 1862US2025112111A1Fan-out panel level packaging structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1961US12040526B2Method for manufacturing embedded package structure having air resonant cavityZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
- 2061US11579362B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·13 claims
- 2161US2023282565A1Packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 2261US2025349463A1Embedding method and embedded structure for magnetic transformer, electronic device and storage mediumZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2024·Application pending·0 cites
- 2359US12476230B2Embedded packaging structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·7 claims
- 2459US2024332224A1Embedded magnetic device integrated structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2558US11569177B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·7 claims
- 2658US11257713B2Interposer board without feature layer structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·17 claims
- 2758US2024321594A1Embedded magnet frame, integrated structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2858US2024274491A1Package carrier plate with embedded efficient heat dissipation module and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2958US2024312796A1Organic interposer structure, manufacturing method and package structure thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3057US11984414B2Packaging structure with antenna and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 14, 2024·0 cites·14 claims
- 3157US2024312879A1Metal frame chip embedded packaging substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 3256US12451447B2Substrate embedded with integrated inductor and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·10 claims
- 3356US11450619B2Embedded packaging structure having shielding cavity and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·16 claims
- 3456US2024063055A1Manufacturing method for device embedded packaging structureZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3555US2024021740A1Light-emitting photosensitive sensor structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3655US2024096836A1Chip high-density interconnection package structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3755US2024116752A1Packaged cavity structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3854US12300576B2Cyclic cooling embedded packaging substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 13, 2025·0 cites·8 claims
- 3954US2024186230A1Component package substrate structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4054US2024113031A1Semiconductor package structure and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4154US2024222143A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4254US2024266244A1Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4353US12278227B2Hybrid embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 4453US11903133B2Structure for embedding and packaging multiple devices by layer and method for manufacturing sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4553US2024222245A1Method for manufacturing embedded device packaging substrate, packaging substrate, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4653US2024079287A1Method for manufacturing high-heat-dissipation mixed substrate, and semiconductor structureZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4753US2024194578A1Embedded device package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 4852US12418988B2Inductor-integrating embedded support frame and substrate, and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·5 claims
- 4952US12002734B2Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 5052US2023127494A1Signal-heat separated tmv packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →