Inventor · disambiguated record
Behdad Jafari
Also filed as: JAFARI BEHDAD
7 granted patents·3 pending applications·55 citations·filing 2002–2009
85Inventor score
Top patents by PatentIndex Score
10 records- 0181US8482120B2Combined heat sink multi-configuration processor memory substrate deviceJAFARI BEHDAD·Filed 2007·Granted Jul 9, 2013·8 cites·10 claims
- 0277US8264851B2Multi-configuration processor-memory substrate deviceJAFARI BEHDAD·Filed 2007·Granted Sep 11, 2012·7 cites·3 claims
- 0374US8198727B1Integrated circuit/substrate interconnect system and method of manufactureSINGH INDERJIT·Filed 2006·Granted Jun 12, 2012·8 cites·21 claims
- 0466US7254033B2Method and apparatus for heat dissipationJAFARI BEHDAD·Filed 2004·Granted Aug 7, 2007·14 cites·25 claims
- 0565US6894385B1Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technologyNVIDIA CORP·Filed 2003·Granted May 17, 2005·14 cites·18 claims
- 0662US7838999B1System and method of manufacture for interconnecting an integrated circuit and a substrateNVIDIA CORP·Filed 2007·Granted Nov 23, 2010·2 cites·22 claims
- 0756US2010103605A1multi-configuration processor-memory substrate deviceNVIDIA CORP·Filed 2009·Application pending·0 cites
- 0854US2010103604A1Multi-configuration processor-memory substrate deviceNVIDIA CORP·Filed 2009·Application pending·0 cites
- 0948US8837161B2Multi-configuration processor-memory substrate deviceJAFARI BEHDAD·Filed 2002·Granted Sep 16, 2014·2 cites·12 claims
- 1042US2008266786A1Method and apparatus for heat dissipationJAFARI BEHDAD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →