Inventor · disambiguated record
Bennett A. Joiner
Also filed as: JOINER BENNETT · JOINER BENNETT A · JOINER JR BENNETT A
8 granted patents·534 citations·filing 1990–2004
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0193US5105259AThermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipationMOTOROLA INC·Filed 1990·Granted Apr 14, 1992·172 cites·15 claims
- 0287US5147821AMethod for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operationMOTOROLA INC·Filed 1991·Granted Sep 15, 1992·103 cites·17 claims
- 0386US5734201ALow profile semiconductor device with like-sized chip and mounting substrateMOTOROLA INC·Filed 1994·Granted Mar 31, 1998·110 cites·3 claims
- 0482US7361985B2Thermally enhanced molded package for semiconductorsFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Apr 22, 2008·41 cites·27 claims
- 0580US5483098ADrop-in heat sink package with window frame flagMOTOROLA INC·Filed 1994·Granted Jan 9, 1996·68 cites·20 claims
- 0659US5683944AMethod of fabricating a thermally enhanced lead frameMOTOROLA INC·Filed 1995·Granted Nov 4, 1997·30 cites·11 claims
- 0751US6847102B2Low profile semiconductor device having improved heat dissipationFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 25, 2005·7 cites·14 claims
- 0848US6933599B2Electromagnetic noise shielding in semiconductor packages using caged interconnect structuresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →