Inventor · disambiguated record
Benben Li
Also filed as: LI BENBEN
12 granted patents·56 citations·filing 2011–2022
88Inventor score
Top patents by PatentIndex Score
12 records- 0196US9412821B2Stacked thin channels for boost and leakage improvementINTEL CORP·Filed 2015·Granted Aug 9, 2016·15 cites·20 claims
- 0295US9209199B2Stacked thin channels for boost and leakage improvementINTEL CORP·Filed 2014·Granted Dec 8, 2015·25 cites·16 claims
- 0394US11289163B2Multi-decks memory device including inter-deck switchesMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 29, 2022·3 cites·15 claims
- 0489US10475515B2Multi-decks memory device including inter-deck switchesMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 12, 2019·7 cites·32 claims
- 0580US8816435B2Flexible hybrid plasma-semiconductor transistors and arraysEDEN J GARY·Filed 2011·Granted Aug 26, 2014·4 cites·11 claims
- 0675US10825523B2Multi-decks memory device including inter-deck switchesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·2 cites·20 claims
- 0771US11763889B2Multi-decks memory device including inter-deck switchesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 0862US11569258B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 31, 2023·0 cites·12 claims
- 0958US9184341B2Flexible and on wafer hybrid plasma-semiconductor transistorsUNIV ILLINOIS·Filed 2014·Granted Nov 10, 2015·0 cites·19 claims
- 1056US9263558B2Hybrid plasma-semiconductor transistors, logic devices and arraysUNIV ILLINOIS·Filed 2014·Granted Feb 16, 2016·0 cites·16 claims
- 1154US10748921B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·0 cites·25 claims
- 1253US9330877B2Logic function generation from single microplasma transistor devices and arrays of devicesUNIV ILLINOIS·Filed 2015·Granted May 3, 2016·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →