Inventor · disambiguated record
Been-Yang Liaw
Also filed as: LIAW BEEN-YANG
13 granted patents·7 pending applications·59 citations·filing 1997–2021
89Inventor score
Files withHON HAI PREC IND CO LTD8LIAW BEEN-YANG4NAT SCIENCE COUNCIL3CHIEN CHENG-CHING2FOXCONN INTERCONNECT TECHNOLOGY LTD1
Top patents by PatentIndex Score
20 records- 0183US7785126B2Reinforced backplate for use with electrical connector assembly having insulative coating thereonHON HAI PREC IND CO LTD·Filed 2009·Granted Aug 31, 2010·12 cites·3 claims
- 0282US7621762B2BGA socket having extensible solder ball so as to compensate warpage connector housingHON HAI PREC IND CO LTD·Filed 2008·Granted Nov 24, 2009·10 cites·7 claims
- 0373US8403681B2Electrical connector and assembly thereofCHIEN CHENG-CHING·Filed 2011·Granted Mar 26, 2013·9 cites·12 claims
- 0468US7993145B1Socket connector having electrical contact with low profileHON HAI PREC IND CO LTD·Filed 2010·Granted Aug 9, 2011·6 cites·19 claims
- 0566US9142932B2Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder jointLIAW BEEN-YANG·Filed 2012·Granted Sep 22, 2015·6 cites·13 claims
- 0651US7771223B2Electrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted Aug 10, 2010·0 cites·5 claims
- 0751US5844065A2,2'-dimethyl-4,4'-bis (4-aminophenoxy) biphenyl, and polymers prepared therefrom by polycondensationNAT SCIENCE COUNCIL·Filed 1997·Granted Dec 1, 1998·10 cites·7 claims
- 0843US2022418087A1Multilayered flexible printed circuit, method for manufacturing the same, and application thereofICARE DIAGNOSTICS INT CO LTD·Filed 2021·Application pending·0 cites
- 0942US7963778B2Burn-in socket with plated contactsHON HAI PREC IND CO LTD·Filed 2008·Granted Jun 21, 2011·0 cites·6 claims
- 1041US2011227113A1Lead frame having ul reflective coatingHON HAI PREC IND CO LTD·Filed 2011·Application pending·0 cites
- 1140US8748906B2LED lead frame having insert-molded electrostatic discharge protection deviceLIAW BEEN-YANG·Filed 2011·Granted Jun 10, 2014·0 cites·12 claims
- 1238US11027274B2Microfluidic cartridge and stacked testing assembly with microfluidic cartridge thereofFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2018·Granted Jun 8, 2021·0 cites·1 claims
- 1338US2007155220A1Electrical connectorHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 1436US2011086558A1Electrical contact with improved material and method manufacturing the sameHON HAI PREC IND CO LTD·Filed 2010·Application pending·0 cites
- 1536US2012061810A1Led lead frame having different mounting surfacesCHIEN CHENG-CHING·Filed 2011·Application pending·0 cites
- 1635US6087470APreparation of soluble polyamide, polyimide and poly(amide-imide)NAT SCIENCE COUNCIL REPUBLIC CHINA·Filed 1998·Granted Jul 11, 2000·3 cites·5 claims
- 1734US2011291152A1Led lead frame with water-repellent layerLIAW BEEN-YANG·Filed 2011·Application pending·0 cites
- 1833US6137008AFlexible diamine compound for preparation of polyamide and polyimideNAT SCIENCE COUNCIL·Filed 1999·Granted Oct 24, 2000·2 cites·2 claims
- 1932US2012100758A1Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder jointLIAW BEEN-YANG·Filed 2011·Application pending·0 cites
- 2031US5817741AFlexible diamine compound, and polyamide and polyimide prepared therefrom by polycondensationNAT SCIENCE COUNCIL·Filed 1997·Granted Oct 6, 1998·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →