Inventor · disambiguated record
Beng Beng Lim
Also filed as: LIM BENG BENG
8 granted patents·1 pending application·14 citations·filing 2016–2020
78Inventor score
Top patents by PatentIndex Score
9 records- 0185US9735114B1Method of packaging semiconductor deviceDelta Electronics Int'l (Singapore) Pte Ltd·Filed 2016·Granted Aug 15, 2017·5 cites·16 claims
- 0284US10424573B1Packaging processDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2018·Granted Sep 24, 2019·6 cites·13 claims
- 0376US10412821B1Dual side cooling structureDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2018·Granted Sep 10, 2019·3 cites·8 claims
- 0461US11081461B2Packaging process and packaging structureDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2020·Granted Aug 3, 2021·0 cites·15 claims
- 0557US11121110B2Packaging process and packaging structureDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2019·Granted Sep 14, 2021·0 cites·6 claims
- 0653US10910303B2Package structure and manufacturing method thereofDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 0744US11133235B2Heat-dissipating semiconductor package including a plurality of metal pins between first and second encapsulation membersDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2019·Granted Sep 28, 2021·0 cites·19 claims
- 0842US2020152557A1Package structure and packaging processDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2019·Application pending·0 cites
- 0939US10892205B2Package structure and power module using sameDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →