Inventor · disambiguated record

Benjamin L. Mcclain

Also filed as: MCCLAIN BENJAMIN L

19 granted patents·3 pending applications·30 citations·filing 2017–2024

91Inventor score

Technology areasH10W H10P

Files withMICRON TECHNOLOGY INC22

Top patents by PatentIndex Score

22 records

0192US11594432B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 28, 2023·2 cites·19 claims
0290US10090177B1Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·5 cites·10 claims
0386US10950568B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 16, 2021·4 cites·6 claims
0485US11670612B2Method for solder bridging elimination for bulk solder C2S interconnectsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·1 cites·14 claims
0585US10276539B1Method for 3D ink jet TCB interconnect controlMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·7 cites·18 claims
0684US10548230B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 28, 2020·3 cites·18 claims
0783US11410962B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·1 cites·22 claims
0882US10952333B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
0981US10840210B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·11 claims
1079US2024429191A1Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
1178US10840209B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·14 claims
1276US12080678B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 3, 2024·0 cites·11 claims
1376US10410891B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·1 cites·16 claims
1468US12087720B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
1566US11705425B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·18 claims
1664US10998208B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·0 cites·17 claims
1761US11410963B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
1859US2021111132A1Method for Substrate Moisture NCF Voiding EliminationMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
1953US11024595B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 1, 2021·0 cites·19 claims
2052US10879195B2Method for substrate moisture NCF voiding eliminationMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·10 claims
2150US2019067232A1Method for Solder Bridging Elimination for Bulk Solder C2S InterconnectsMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
2243US10700038B2Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing toolMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 30, 2020·0 cites·25 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →