Inventor · disambiguated record
Behrooz Mehr
Also filed as: MEHR BEHROOZ · MEHR BEHROOZ Z
11 granted patents·1 pending application·217 citations·filing 1994–2022
89Inventor score
Top patents by PatentIndex Score
12 records- 0183US5530295ADrop-in heat sinkINTEL CORP·Filed 1995·Granted Jun 25, 1996·67 cites·3 claims
- 0276US5936848AElectronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the viasINTEL CORP·Filed 1998·Granted Aug 10, 1999·56 cites·17 claims
- 0375US7505248B2Controlled-resistance capacitors, and methods of assembling sameINTEL CORP·Filed 2005·Granted Mar 17, 2009·9 cites·22 claims
- 0465US5444909AMethod of making a drop-in heat sinkINTEL CORP·Filed 1994·Granted Aug 29, 1995·31 cites·2 claims
- 0562US11769713B2Lead frames having rounded corners and related packages and methodsMICROCHIP TECH INC·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0660US6133134ABall grid array integrated circuit packageINTEL CORP·Filed 1997·Granted Oct 17, 2000·26 cites·11 claims
- 0760US5489805ASlotted thermal dissipater for a semiconductor packageINTEL CORP·Filed 1995·Granted Feb 6, 1996·28 cites·4 claims
- 0857US11430718B2Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methodsMICROCHIP TECH INC·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 0950US11476208B2Grounding techniques for backside-biased semiconductor dice and related devices, systems and methodsMICROCHIP TECH INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1042US10741507B2Grounding techniques for backside-biased semiconductor dice and related devices, systems and methodsMICROCHIP TECH INC·Filed 2018·Granted Aug 11, 2020·0 cites·5 claims
- 1133US2006001068A1Multi-layer capacitor using dielectric layers having differing compositionsMOSLEY LARRY E·Filed 2004·Application pending·0 cites
- 1227US6924970B2Capacitor method and apparatusINTEL CORP·Filed 2002·Granted Aug 2, 2005·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →