Inventor · disambiguated record
Benjamin A. Samples
Also filed as: SAMPLES BENJAMIN A · SAMPLES BENJAMIN ALLEN
7 granted patents·2 pending applications·12 citations·filing 2010–2021
76Inventor score
Top patents by PatentIndex Score
9 records- 0178US11031332B2Package panel processing with integrated ceramic isolationTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 8, 2021·2 cites·26 claims
- 0274US8410601B2RF packageSAMPLES BENJAMIN A·Filed 2010·Granted Apr 2, 2013·7 cites·9 claims
- 0367US8034666B2Multi-layer thick-film RF packageMICROSEMI CORP·Filed 2010·Granted Oct 11, 2011·3 cites·15 claims
- 0466US11869839B2Package panel processing with integrated ceramic isolationTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 0558US11984433B2Arrangements of power semiconductor devices for improved thermal performanceWOLFSPEED INC·Filed 2021·Granted May 14, 2024·0 cites·33 claims
- 0642US11158567B2Package with stacked power stage and integrated control dieTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 26, 2021·0 cites·17 claims
- 0740US2020194390A1Package with dual layer routing including ground return pathTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 0837US2020203259A1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 0936US10522443B2Lid cover spring designMICROSEMI CORP·Filed 2018·Granted Dec 31, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →