Inventor · disambiguated record
Bernd Schmoelzer
Also filed as: SCHMOELZER BERND
16 granted patents·9 pending applications·12 citations·filing 2016–2024
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
25 records- 0194US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0291US11728250B2Semiconductor package with connection lugINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 0380US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0480US10373897B2Semiconductor devices with improved thermal and electrical performanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·4 cites·8 claims
- 0578US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0677US12463116B2Method for fabricating a semiconductor device including an embedded semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0774US11211304B2Assembly and method for mounting an electronic component to a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Dec 28, 2021·2 cites·20 claims
- 0869US10755999B2Multi-package top-side-coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 25, 2020·1 cites·20 claims
- 0964US12002739B2Semiconductor device including an embedded semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jun 4, 2024·0 cites·18 claims
- 1064US9972576B2Semiconductor chip package comprising side wall markingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted May 15, 2018·1 cites·16 claims
- 1160US12080669B2Semiconductor device module having vertical metallic contacts and a method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1259US2024170377A1Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device ModuleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1357US12438068B2Stacked module arrangementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1457US11942383B2Linear spacer for spacing a carrier of a packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 1556US12506051B2Semiconductor package comprising a cavity with exposed contacts and a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 23, 2025·0 cites·16 claims
- 1656US2023360929A1Method for fabricating a semiconductor device module with increased reliability and a semiconductor device moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1755US2023282591A1Semiconductor package and a semiconductor device module including the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1854US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1954US2024014104A1Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor TransistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 2053US2023378011A1Electronic device module and a device module both having an adhesion promoter layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 2152US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2251US2024162205A1Power semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 2350US2023106642A1Embedded package with delamination mitigationINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Application pending·0 cites
- 2449US12125772B2Method of forming a semiconductor package with connection lugINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Oct 22, 2024·0 cites·17 claims
- 2544US10699978B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →