Inventor · disambiguated record
Beda Steiner
Also filed as: STEINER BEDA
3 granted patents·6 pending applications·10 citations·filing 2008–2024
60Inventor score
Top patents by PatentIndex Score
9 records- 0185US10190028B2Epoxy two-part formulationsDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Jan 29, 2019·3 cites·2 claims
- 0283US2024301257A1Epoxy adhesive composition and method of useDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0382US8278398B2Two part crash durable epoxy adhesivesLUTZ ANDREAS·Filed 2008·Granted Oct 2, 2012·7 cites·17 claims
- 0466US2022204820A1Epoxy adhesive composition and method of useDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 0563US11674063B2Epoxy resin adhesive compositionsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Jun 13, 2023·0 cites·14 claims
- 0663US2024376353A1Two-component structural adhesiveDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2022·Application pending·0 cites
- 0763US2017335147A1Accelerated and Toughened Two-Part Epoxy AdhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Application pending·0 cites
- 0862US2015184039A1Accelerated and toughened two part epoxy adhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Application pending·0 cites
- 0947US2020140727A1Two-component room temperature curable toughened epoxy adhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Beda Steiner files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →