Inventor · disambiguated record
Beng Yee Teh
Also filed as: TEH’ BENG YEE
1 granted patent·2 pending applications·0 citations·filing 2007–2023
11Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0155US2025087545A1Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical ComponentSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0246US2025096095A1Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder BumpsSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0330US8274145B2Semiconductor package system with patterned mask over thermal reliefALABIN LEOCADIO M·Filed 2007·Granted Sep 25, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →