Inventor · disambiguated record
Bernhard Winkler
Also filed as: WINKLER BERNHARD
69 granted patents·10 pending applications·257 citations·filing 1989–2024
98Inventor score
Files withINFINEON TECHNOLOGIES AG37HILTI AG15INFINEON TECHNOLOGIES DRESDEN GMBH5KOLB STEFAN3WINKLER BERNHARD3
Top patents by PatentIndex Score
79 records- 0194US11885705B2Fully differential capacitive pressure sensor including stacked sensor and reference capacitorsINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 30, 2024·3 cites·15 claims
- 0292US9884757B2MEMS sensor package systems and methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 6, 2018·11 cites·21 claims
- 0391US8618620B2Pressure sensor package systems and methodsWINKLER BERNHARD·Filed 2010·Granted Dec 31, 2013·13 cites·19 claims
- 0490US9970465B2Expansion anchor with an anisotropic coefficient of frictionHILTI AG·Filed 2014·Granted May 15, 2018·15 cites·5 claims
- 0588US8635832B2Mounting railHEUDORFER MARKUS·Filed 2011·Granted Jan 28, 2014·34 cites·29 claims
- 0687US10584731B2Expansion anchor with grooves in the expansion coneHILTI AG·Filed 2017·Granted Mar 10, 2020·5 cites·9 claims
- 0786US7889030B2Passive temperature compensation of silicon MEMS devicesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Feb 15, 2011·16 cites·25 claims
- 0885US10018213B2Expansion anchor having a high-strength expansion sleeve in certain areasHILTI AG·Filed 2014·Granted Jul 10, 2018·12 cites·11 claims
- 0984US10899604B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·3 cites·10 claims
- 1083US11422151B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 23, 2022·1 cites·21 claims
- 1183US10823219B2Thread-forming screw with separate thread sprial and different part flank anglesHILTI AG·Filed 2016·Granted Nov 3, 2020·5 cites·6 claims
- 1283US9145292B2Cavity structures for MEMS devicesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·5 cites·24 claims
- 1383US9021887B2Micromechanical semiconductor sensing deviceKALZ FRANZ-PETER·Filed 2011·Granted May 5, 2015·6 cites·3 claims
- 1482US8040207B2MEMS resonator devices with a plurality of mass elements formed thereonINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 18, 2011·8 cites·20 claims
- 1581US2024377271A1Media-resistant pressure sensor for large pressure rangesINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1680US11118345B2Structure having edge reinforcement on profiled railHILTI AG·Filed 2018·Granted Sep 14, 2021·6 cites·34 claims
- 1780US9464524B2Anchor rodGLOGGER JOSEF·Filed 2012·Granted Oct 11, 2016·10 cites·13 claims
- 1878US11733060B2Diagnosis of electrical failures in capacitive sensorsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·1 cites·30 claims
- 1978US10571681B2Membrane structures for microelectromechanical pixel and display devices and systems, and methods for forming membrane structures and related devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 25, 2020·1 cites·20 claims
- 2078US8476990B2MEMS resonator devicesWINKLER BERNHARD·Filed 2011·Granted Jul 2, 2013·4 cites·29 claims
- 2176US12332271B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 17, 2025·0 cites·13 claims
- 2276US8198690B2MEMS devices and methods of manufacture thereofSCHOEN FLORIAN·Filed 2010·Granted Jun 12, 2012·2 cites·13 claims
- 2374US12510428B2Media-resistant pressure sensor for large pressure rangesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2474US8318581B2Micro-electromechanical system devicesMUELLER KARL-HEINZ·Filed 2011·Granted Nov 27, 2012·2 cites·10 claims
- 2573US7535217B2Force sensor array having magnetostrictive magnetoresistive sensors and method for determining a forceINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 19, 2009·8 cites·24 claims
- 2671US11286661B2Profile rail with reinforcing elementHILTI AG·Filed 2018·Granted Mar 29, 2022·2 cites·12 claims
- 2771US9546923B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 17, 2017·3 cites·19 claims
- 2870US10996125B2Pressure sensors and method for forming a MEMS pressure sensorINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 4, 2021·1 cites·33 claims
- 2970US10684306B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 16, 2020·1 cites·20 claims
- 3069US9790086B2Micromechanical semiconductor sensing deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·1 cites·2 claims
- 3169US9139427B2Methods for producing a cavity within a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·2 cites·11 claims
- 3269US9013014B2Chip package and a method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·2 cites·9 claims
- 3369US7851875B2MEMS devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2008·Granted Dec 14, 2010·2 cites·25 claims
- 3468US12436050B2Pressure sensors and method for forming a MEMS pressure sensorINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 3568US8266962B2Acceleration sensorKAUTZSCH THORALF·Filed 2009·Granted Sep 18, 2012·4 cites·28 claims
- 3668US5177925AWall element for the dry construction of wallsWALDORMILLS CO·Filed 1990·Granted Jan 12, 1993·31 cites·6 claims
- 3767US11505450B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 22, 2022·0 cites·9 claims
- 3866US9869334B2Expansion anchor with grooves in the expansion coneHILTI AG·Filed 2014·Granted Jan 16, 2018·2 cites·11 claims
- 3964US8076738B2Integrally fabricated micromachine and logic elementsKOLB STEFAN·Filed 2007·Granted Dec 13, 2011·2 cites·12 claims
- 4064US7111855B2Link adjustment mechanismDAIMLER CHRYSLER CORP·Filed 2003·Granted Sep 26, 2006·17 cites·20 claims
- 4162US8125046B2Micro-electromechanical system devicesMUELLER KARL-HEINZ·Filed 2008·Granted Feb 28, 2012·2 cites·28 claims
- 4261US11920341B2Profile rail with reinforcing elementHILTI AG·Filed 2022·Granted Mar 5, 2024·0 cites·17 claims
- 4361US9933002B2Expansion anchor with a swelling element for securing the sleeveHILTI AG·Filed 2014·Granted Apr 3, 2018·2 cites·9 claims
- 4460US11885117B2Structure having edge reinforcement on profiled railHILTI AG·Filed 2021·Granted Jan 30, 2024·0 cites·25 claims
- 4560US10544037B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 4659US10060816B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Aug 28, 2018·0 cites·19 claims
- 4758US11192777B2MEMS sensor package systems and methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 7, 2021·0 cites·21 claims
- 4857US9896329B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 4957US9598277B2Cavity structures for MEMS devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 21, 2017·0 cites·11 claims
- 5057US8993394B2Micro-electromechanical system devicesINFINEON TECHNOLOGIES AG·Filed 2012·Granted Mar 31, 2015·0 cites·12 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →