Inventor · disambiguated record
Bharani Chava
Also filed as: CHAVA BHARANI · CHAVA BHARANI CHAKRAVARTHY
17 granted patents·44 citations·filing 2019–2023
89Inventor score
Top patents by PatentIndex Score
17 records- 0195US11710733B2Vertical power grid standard cell architectureQUALCOMM INC·Filed 2020·Granted Jul 25, 2023·4 cites·12 claims
- 0294US11270991B1Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methodsQUALCOMM INC·Filed 2020·Granted Mar 8, 2022·5 cites·25 claims
- 0392US11176991B1Compute-in-memory (CIM) employing low-power CIM circuits employing static random access memory (SRAM) bit cells, particularly for multiply-and-accumluate (MAC) operationsQUALCOMM INC·Filed 2020·Granted Nov 16, 2021·28 cites·27 claims
- 0489US11764186B2Package comprising an integrated device configured for shareable power resourceQUALCOMM INC·Filed 2021·Granted Sep 19, 2023·2 cites·35 claims
- 0587US11876085B2Package with a substrate comprising an embedded capacitor with side wall couplingQUALCOMM INC·Filed 2021·Granted Jan 16, 2024·2 cites·19 claims
- 0682US11552055B2Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Jan 10, 2023·1 cites·30 claims
- 0772US12400966B2Package comprising integrated devices and bridge coupling top sides of integrated devicesQUALCOMM INC·Filed 2023·Granted Aug 26, 2025·0 cites·25 claims
- 0872US12057436B2Package comprising an integrated device configured for shareable power resourceQUALCOMM INC·Filed 2023·Granted Aug 6, 2024·0 cites·28 claims
- 0972US11645503B2Multibit neural networkIMEC VZW·Filed 2019·Granted May 9, 2023·2 cites·20 claims
- 1064US11830819B2Package comprising integrated devices and bridge coupling top sides of integrated devicesQUALCOMM INC·Filed 2021·Granted Nov 28, 2023·0 cites·30 claims
- 1156US11515289B2Stacked die integrated with package voltage regulatorsQUALCOMM INC·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1255US11430797B2Package embedded programmable resistor for voltage droop mitigationQUALCOMM INC·Filed 2020·Granted Aug 30, 2022·0 cites·28 claims
- 1355US11195793B2Metal filling in a dielectric layer under metal layer one (M1)and above an active device layer in semiconductor devicesQUALCOMM INC·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 1449US11668735B2Granular sensing on an integrated circuitQUALCOMM INC·Filed 2020·Granted Jun 6, 2023·0 cites·24 claims
- 1549US11437379B2Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuitsQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·21 claims
- 1644US11449740B2Synapse circuit with memoryIMEC VZW·Filed 2019·Granted Sep 20, 2022·0 cites·14 claims
- 1739US11749327B2Memory bit cell circuit including a bit line coupled to a static random-access memory (SRAM) bit cell circuit and a non-volatile memory (NVM) bit cell circuit and a memory bit cell array circuitQUALCOMM INC·Filed 2021·Granted Sep 5, 2023·0 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Bharani Chava files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →