Inventor · disambiguated record
Bhaskar Jyoti Krishnatreya
Also filed as: KRISHNATREYA BHASKAR JYOTI
3 granted patents·23 pending applications·1 citations·filing 2013–2024
49Inventor score
Top patents by PatentIndex Score
26 records- 0172US2025015028A1Singulation of microelectronic components with direct bonding interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 0269US2025109221A1Cross-linked hydrophobic coating with plasma resistance for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0363US12119317B2Singulation of microelectronic components with direct bonding interfacesINTEL CORP·Filed 2020·Granted Oct 15, 2024·0 cites·19 claims
- 0461US9188529B2Holographic microrefractometer for determining refractive index of a mediumUNIV NEW YORK·Filed 2013·Granted Nov 17, 2015·1 cites·16 claims
- 0559US2024347590A1Methods and apparatus to reduce stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0659US2025210392A1Handling assembly, handling system and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0759US2025218847A1Configurable carrier for transfer and self-assembly of multiple integrated circuit devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 0858US2025112200A1Hybrid bonding of thin die structures by self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025006695A1Packaging architecture including compensation layers for wafer-scale known-good-die to known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US2024429199A1Methods and apparatus for self-aligning batch pick and place die bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 1152US2025006653A1Fiducials with associated low-density metal zonesINTEL CORP·Filed 2023·Application pending·0 cites
- 1252US2024063179A1Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 1352US2025006652A1Fiducials with underlying dummy metallization for integrated circuit device alignmentINTEL CORP·Filed 2023·Application pending·0 cites
- 1452US2025006651A1Slit fiducials for integrated circuit device alignmentINTEL CORP·Filed 2023·Application pending·0 cites
- 1552US2024063071A1Inorganic material deposition for inter-die fill in multi-chip composite structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 1652US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 1751US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2024347501A1Methods and apparatus for die-shape modification bondingNIAZI HARIS KHAN·Filed 2024·Application pending·0 cites
- 1950US2024061194A1Photonic quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 2050US2024063076A1Integrated conformal thermal heat spreader for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2150US2024063089A1Thermal management of base dies in multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2250US2024063143A1Device, method, and system to mitigate warpage of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2024063180A1Ic die composites with inorganic inter-die fill structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2450US2024063147A1Device, method, and system to protect through-dielectric vias of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2548US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2642US10983041B2Fast feature identification for holographic tracking and characterization of colloidal particlesUNIV NEW YORK·Filed 2015·Granted Apr 20, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →