Inventor · disambiguated record
Biju Chandran
Also filed as: CHANDRAN BIJU · CHANDRAN BIJU I
22 granted patents·1 pending application·385 citations·filing 1999–2011
96Inventor score
Top patents by PatentIndex Score
23 records- 0192US7078822B2Microelectronic device interconnectsINTEL CORP·Filed 2002·Granted Jul 18, 2006·52 cites·12 claims
- 0286US6750549B1Variable pad diameter on the land side for improving the co-planarity of ball grid array packagesINTEL CORP·Filed 2002·Granted Jun 15, 2004·43 cites·30 claims
- 0384US7122403B2Method of interconnecting die and substrateINTEL CORP·Filed 2004·Granted Oct 17, 2006·26 cites·17 claims
- 0481US6812548B2Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2001·Granted Nov 2, 2004·28 cites·13 claims
- 0581US6790709B2Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2001·Granted Sep 14, 2004·28 cites·6 claims
- 0680US7304391B2Modified chip attach process and apparatusINTEL CORP·Filed 2005·Granted Dec 4, 2007·6 cites·19 claims
- 0780US6919224B2Modified chip attach process and apparatusINTEL CORP·Filed 2003·Granted Jul 19, 2005·19 cites·20 claims
- 0879US6310773B1Heat sink systemINTEL CORP·Filed 1999·Granted Oct 30, 2001·60 cites·19 claims
- 0976US7901982B2Modified chip attach processINTEL CORP·Filed 2009·Granted Mar 8, 2011·4 cites·6 claims
- 1076US7579213B2Modified chip attach processINTEL CORP·Filed 2007·Granted Aug 25, 2009·4 cites·12 claims
- 1175US6955947B2Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2004·Granted Oct 18, 2005·19 cites·12 claims
- 1272US6600652B2Package retention module coupled directly to a socketINTEL CORP·Filed 2001·Granted Jul 29, 2003·16 cites·12 claims
- 1370US7235886B1Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made therebyINTEL CORP·Filed 2001·Granted Jun 26, 2007·16 cites·29 claims
- 1469US6672892B2Package retention module coupled directly to a socketINTEL CORP·Filed 2001·Granted Jan 6, 2004·13 cites·27 claims
- 1568US8324737B2Modified chip attach processCHANDRAN BIJU·Filed 2011·Granted Dec 4, 2012·2 cites·6 claims
- 1666US7314817B2Microelectronic device interconnectsINTEL CORP·Filed 2005·Granted Jan 1, 2008·3 cites·20 claims
- 1764US7064014B2Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devicesINTEL CORP·Filed 2004·Granted Jun 20, 2006·10 cites·14 claims
- 1862US6752634B2Contact array for semiconductor packageINTEL CORP·Filed 2001·Granted Jun 22, 2004·9 cites·26 claims
- 1956US6256199B1Integrated circuit cartridge and method of fabricating the sameINTEL CORP·Filed 1999·Granted Jul 3, 2001·24 cites·20 claims
- 2051US7202420B2Methods to prevent mechanical flexure related BGA failureINTEL CORP·Filed 2003·Granted Apr 10, 2007·3 cites·17 claims
- 2148US7691667B2Compliant integrated circuit package substrateINTEL CORP·Filed 2006·Granted Apr 6, 2010·0 cites·4 claims
- 2247US7745917B2Compliant integrated circuit package substrateINTEL CORP·Filed 2010·Granted Jun 29, 2010·0 cites·13 claims
- 2340US2003116860A1Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stressesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →