Inventor · disambiguated record
Bigildis Dosdos
Also filed as: DOSDOS BIGILDIS · DOSDOS BIGILDIS C
13 granted patents·2 pending applications·50 citations·filing 2007–2024
88Inventor score
Technology areasH10W
Files withFAIRCHILD SEMICONDUCTOR6SEMICONDUCTOR COMPONENTS IND LLC5JEON OSEOB1KINZER DANIEL M1SAPP STEVEN1
Top patents by PatentIndex Score
15 records- 0186US8193043B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameJEON OSEOB·Filed 2010·Granted Jun 5, 2012·9 cites·18 claims
- 0283US8487371B2Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the sameKINZER DANIEL M·Filed 2011·Granted Jul 16, 2013·7 cites·16 claims
- 0382US7800219B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Sep 21, 2010·10 cites·9 claims
- 0481US8723300B2Multi-chip module power clipWU CHUNG-LIN·Filed 2012·Granted May 13, 2014·7 cites·21 claims
- 0581US7868432B2Multi-chip module for battery power controlFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Jan 11, 2011·14 cites·13 claims
- 0675US2024429136A1Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0772US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0867US8003447B2Multi-chip module for battery power controlFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Aug 23, 2011·3 cites·5 claims
- 0961US12087677B2Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 1059US11177203B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 1155US10256178B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 1251US11004777B2Semiconductor device assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 11, 2021·0 cites·22 claims
- 1347US11075148B2Stacked transistor assembly with dual middle mounting clipsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 27, 2021·0 cites·17 claims
- 1444US9379045B2Common drain power clip for battery pack protection mosfetFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Jun 28, 2016·0 cites·24 claims
- 1543US2009261461A1Semiconductor package with lead intrusionsSAPP STEVEN·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →