Inventor · disambiguated record
Bill Klaasen
Also filed as: KLAASEN BILL
2 granted patents·33 citations·filing 1995–1997
64Inventor score
Technology areasH10D
Top patents by PatentIndex Score
2 records- 0160US5798301AMethod of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliabilitySIEMENS AG·Filed 1997·Granted Aug 25, 1998·18 cites·9 claims
- 0256US5641992AMetal interconnect structure for an integrated circuit with improved electromigration reliabilitySIEMENS COMP INC·Filed 1995·Granted Jun 24, 1997·15 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →