Inventor · disambiguated record
Bin-Wei Lee
Also filed as: LEE BIN · LEE BIN-WEI
3 granted patents·11 pending applications·3 citations·filing 2006–2017
54Inventor score
Files withHWANG MING-HANG9KOREA ADVANCED INST SCI & TECH2MITAC TECHNOLOGY CORP2KOREA ADVANCED INST OF SCEINCE AND TECHNOLOGY1
Top patents by PatentIndex Score
14 records- 0173US9745499B2Hexagonal boron nitride nanosheet/ceramic nanocomposite powder and producing method of the same, and hexagonal boron nitride nanosheet/ceramic nanocomposite materials and producing method of the sameKOREA ADVANCED INST SCI & TECH·Filed 2014·Granted Aug 29, 2017·2 cites·8 claims
- 0254US7504148B2Printed circuit board structure and manufacturing method thereofMITAC TECHNOLOGY CORP·Filed 2006·Granted Mar 17, 2009·1 cites·3 claims
- 0348US2017314097A1High-strength and ultra heat-resistant high entropy alloy (hea) matrix composites and method of preparing the sameKOREA ADVANCED INST SCI & TECH·Filed 2017·Application pending·0 cites
- 0445US2007199682A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0543US2007199681A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0641US2014197353A1Graphene/ceramic nanocomposite powder and a production method thereforKOREA ADVANCED INST OF SCEINCE AND TECHNOLOGY·Filed 2014·Application pending·0 cites
- 0735US7427807B2Chip heat dissipation structure and manufacturing methodMITAC TECHNOLOGY CORP·Filed 2006·Granted Sep 23, 2008·0 cites·18 claims
- 0833US2007201203A1Adhesion Material Structure and Process Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0933US2007199678A1Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1033US2006255451A1Heat Conduction Interface Method and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1130US2007199677A1Heat Sink Fin Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1230US2007199679A1Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1330US2007201207A1Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 1428US2006256528A1Air Blown Chip Dissipation Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bin-Wei Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →