Inventor · disambiguated record
Bin-Yuan Lin
Also filed as: LIN BIN · LIN BIN-YUAN
10 granted patents·1 pending application·99 citations·filing 1993–2024
87Inventor score
Files withIND TECH RES INST6BEIJING BYTEDANCE NETWORK TECH CO LTD3JIANGSU NUCLEAR POWER CORP1UNIV TIANJIN1
Top patents by PatentIndex Score
11 records- 0177US6030553APolymer thick film resistor pastesIND TECH RES INST·Filed 1999·Granted Feb 29, 2000·38 cites·11 claims
- 0266US12328842B2Immersed liquid cooling apparatus and liquid cooling systemBEIJING BYTEDANCE NETWORK TECH CO LTD·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 0366US12302535B2Modular air cooling device and cooling systemBEIJING BYTEDANCE NETWORK TECH CO LTD·Filed 2024·Granted May 13, 2025·0 cites·19 claims
- 0463US12276527B1Device and method for measuring levelness of top cover of reactor pressure vesselJIANGSU NUCLEAR POWER CORP·Filed 2024·Granted Apr 15, 2025·0 cites·19 claims
- 0560US6114433APTC conductive polymer compositionIND TECH RES INST·Filed 1998·Granted Sep 5, 2000·17 cites·18 claims
- 0656US5340861APolyphenylene sulfide composition with improved crystallizing characteristicIND TECH RES INST·Filed 1993·Granted Aug 23, 1994·12 cites·18 claims
- 0750US2025063686A1Immersion-type liquid-cooling device and immersion-type liquid-cooling systemBEIJING BYTEDANCE NETWORK TECH CO LTD·Filed 2022·Application pending·0 cites
- 0849US5712043AThermoplastic polyolefin resin composition and laminar articles having improved barrier properties preparedIND TECH RES INST·Filed 1995·Granted Jan 27, 1998·14 cites·15 claims
- 0944US6280907B1Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrateIND TECH RES INST·Filed 1999·Granted Aug 28, 2001·12 cites·10 claims
- 1043US12322849B2Manufacturing method of dielectric waveguide radio-frequency deviceUNIV TIANJIN·Filed 2024·Granted Jun 3, 2025·0 cites·10 claims
- 1138US6072001ALong-term antistatic compositionIND TECH RES INST·Filed 1998·Granted Jun 6, 2000·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →