Inventor · disambiguated record
Bijoyraj Sahu
Also filed as: SAHU BIJOYRAJ
14 granted patents·2 pending applications·21 citations·filing 2011–2024
86Inventor score
Top patents by PatentIndex Score
16 records- 0191US12055986B2Flexible and modular top and bottom side processor unit module coolingINTEL CORP·Filed 2021·Granted Aug 6, 2024·6 cites·25 claims
- 0287US11032941B2Modular thermal energy management designs for data center computingINTEL CORP·Filed 2019·Granted Jun 8, 2021·6 cites·23 claims
- 0383US8727508B2Bonded silicon structure for high density print headNYSTROM PETER J·Filed 2011·Granted May 20, 2014·4 cites·13 claims
- 0480US10418309B1Mechanical seal and reservoir for microelectronic packagesINTEL CORP·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 0578US12504799B2Flexible and modular top and bottom side processor unit module coolingINTEL CORP·Filed 2024·Granted Dec 23, 2025·0 cites·19 claims
- 0673US11291115B2Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array socketsINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·16 claims
- 0758US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 0857US12345474B2Variable conductance heat pipes for improved reliabilityINTEL CORP·Filed 2020·Granted Jul 1, 2025·0 cites·15 claims
- 0956US9038269B2Printhead with nanotips for nanoscale printing and manufacturingXEROX CORP·Filed 2013·Granted May 26, 2015·0 cites·6 claims
- 1053US12494435B2Liquid metal interconnect for modular system on an interposer server architectureINTEL CORP·Filed 2021·Granted Dec 9, 2025·0 cites·22 claims
- 1152US8931879B2Laser transmission laminating of materials for ink jet printheadsNYSTROM PETER J·Filed 2012·Granted Jan 13, 2015·0 cites·10 claims
- 1250US8919915B2Ultrasonic laminating of materials for ink jet printheadsNYSTROM PETER J·Filed 2012·Granted Dec 30, 2014·0 cites·7 claims
- 1346US11387163B2Scalable debris-free socket loading mechanismINTEL CORP·Filed 2018·Granted Jul 12, 2022·0 cites·16 claims
- 1445US2021321526A1Technologies for sealed liquid cooling systemKULKARNI DEVDATTA PRAKASH·Filed 2021·Application pending·0 cites
- 1544US2022415742A1Microelectronic assemblies having dies with backside back-end-of-line heater tracesINTEL CORP·Filed 2021·Application pending·0 cites
- 1642US9889653B2Printhead with nanotips for nanoscale printing and manufacturingXEROX CORP·Filed 2015·Granted Feb 13, 2018·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →