Inventor · disambiguated record
Bily Wang
Also filed as: WANG BILY
103 granted patents·80 pending applications·1,011 citations·filing 1998–2013
99Inventor score
Top patents by PatentIndex Score
183 records- 0195US8031930B2Testing system and testing method for inspecting electonic devicesYOUNGTEK ELECTRONICS CORP·Filed 2008·Granted Oct 4, 2011·64 cites·17 claims
- 0294US7080924B2LED light source with reflecting side wallHARVATEK CORP·Filed 2002·Granted Jul 25, 2006·98 cites·9 claims
- 0393US7563641B2Laminated light-emitting diode display device and manufacturing method thereofHARVATEK CORP·Filed 2006·Granted Jul 21, 2009·21 cites·6 claims
- 0493US6297598B1Single-side mounted light emitting diode moduleHARVATEK CORP·Filed 2001·Granted Oct 2, 2001·85 cites·9 claims
- 0591US8398275B2Lamp head assembly and lighting lamp tubeWANG BILY·Filed 2011·Granted Mar 19, 2013·41 cites·20 claims
- 0691USD595675SLight emitting diodeHARVATEK CORP·Filed 2008·Granted Jul 7, 2009·49 cites·1 claims
- 0788US8555492B2Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachWANG BILY·Filed 2011·Granted Oct 15, 2013·9 cites·4 claims
- 0888US8137999B2Package for a light emitting diode and method for fabricating the sameWANG BILY·Filed 2011·Granted Mar 20, 2012·8 cites·8 claims
- 0988US7140753B2Water-cooling heat dissipation device adopted for modulized LEDsHARVATEK CORP·Filed 2004·Granted Nov 28, 2006·41 cites·3 claims
- 1085US5962922ACavity grid array integrated circuit packageFiled 1998·Granted Oct 5, 1999·76 cites·6 claims
- 1184US7237938B2Backlight moduleHARVATEK CORP·Filed 2005·Granted Jul 3, 2007·14 cites·9 claims
- 1282US7671374B2LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Mar 2, 2010·9 cites·5 claims
- 1380US7671373B2LED chip package structure using a ceramic material as a substrate and a method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Mar 2, 2010·9 cites·17 claims
- 1480US7049639B2LED packaging structureHARVATEK CORP·Filed 2004·Granted May 23, 2006·33 cites·5 claims
- 1579US7211882B2LED package structure and method for making the sameHARVATEK CORP·Filed 2005·Granted May 1, 2007·8 cites·7 claims
- 1678US8519458B2Light-emitting element detection and classification deviceWANG BILY·Filed 2011·Granted Aug 27, 2013·4 cites·14 claims
- 1778US7834365B2LED chip package structure with high-efficiency light-emitting effect and method of packing the sameHARVATEK CORP·Filed 2007·Granted Nov 16, 2010·7 cites·11 claims
- 1878US7614766B2Modular illumination device with adjustable lighting anglesHARVATEK CORP·Filed 2006·Granted Nov 10, 2009·17 cites·14 claims
- 1978USD511328SLight-emitting diodeHARVATEK CORP·Filed 2004·Granted Nov 8, 2005·26 cites·1 claims
- 2077US7696990B2LED driving circuit and a serial LED illumination system using the sameHARVATEK CORP·Filed 2006·Granted Apr 13, 2010·4 cites·14 claims
- 2176US6794686B2White light sourceHARVATEK CORP·Filed 2003·Granted Sep 21, 2004·22 cites·1 claims
- 2276US6574254B1Laser diode package with heat sinking substrateHARVATEK CORP·Filed 2002·Granted Jun 3, 2003·13 cites·7 claims
- 2375US7828464B2LED lamp structure and system with high-efficiency heat-dissipating functionHARVATEK CORP·Filed 2007·Granted Nov 9, 2010·11 cites·26 claims
- 2474US6784458B1Random partitionable dot matrix LED displayHARVATEK CORP·Filed 2003·Granted Aug 31, 2004·20 cites·9 claims
- 2573US8710387B2LED package chip classification systemWANG BILY·Filed 2011·Granted Apr 29, 2014·3 cites·16 claims
- 2673US7964420B2LED chip package structure with an embedded ESD function and method for manufacturing the sameHARVATEK CORP·Filed 2010·Granted Jun 21, 2011·3 cites·10 claims
- 2773US6583447B2Multiple LED chip packageHARVATEK CORP·Filed 2001·Granted Jun 24, 2003·25 cites·8 claims
- 2872US8556463B2Simple detachable illumination structure and lamp tubeWANG BILY·Filed 2011·Granted Oct 15, 2013·5 cites·14 claims
- 2972US8079737B2Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiencyWANG BILY·Filed 2009·Granted Dec 20, 2011·8 cites·17 claims
- 3072US6841934B2White light source from light emitting diodeHARVATEK CORP·Filed 2003·Granted Jan 11, 2005·22 cites·9 claims
- 3172US6534799B1Surface mount light emitting diode packageHARVATEK CORP·Filed 2000·Granted Mar 18, 2003·23 cites·9 claims
- 3271US8686310B2Packaged chip detection and classification deviceWANG BILY·Filed 2011·Granted Apr 1, 2014·2 cites·11 claims
- 3371US7803641B2Mold structure for packaging LED chips and method thereofHARVATEK CORP·Filed 2007·Granted Sep 28, 2010·5 cites·17 claims
- 3471US6627482B2Mass production technique for surface mount optical device with a focusing cupHARVATEK CORP·Filed 2001·Granted Sep 30, 2003·18 cites·12 claims
- 3570US8017969B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameHARVATEK CORP·Filed 2008·Granted Sep 13, 2011·4 cites·12 claims
- 3669US7804162B2Multi-wavelength white light-emitting structureHARVATEK CORP·Filed 2009·Granted Sep 28, 2010·4 cites·13 claims
- 3768US8002436B2LED chip package structure using a substrate as a lampshade and method for making the sameHARVATEK CORPORTION·Filed 2008·Granted Aug 23, 2011·6 cites·6 claims
- 3867US8263876B2Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the sameWANG BILY·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
- 3967USD595674SLight emitting diodeHARVATEK CORP·Filed 2008·Granted Jul 7, 2009·15 cites·1 claims
- 4067US7485480B2Method of manufacturing high power light-emitting device package and structure thereofHARVATEK CORP·Filed 2006·Granted Feb 3, 2009·3 cites·10 claims
- 4166US7255463B2Lighting moduleHARVATEK CORP·Filed 2005·Granted Aug 14, 2007·8 cites·6 claims
- 4265US8623680B2LED chip package structure using sedimentation and method for making the sameWANG BILY·Filed 2011·Granted Jan 7, 2014·2 cites·12 claims
- 4364US8873920B2Light-guiding cover structureWANG BILY·Filed 2012·Granted Oct 28, 2014·2 cites·14 claims
- 4464US8138508B2LED chip package structure with different LED spacings and a method for making the sameWANG BILY·Filed 2008·Granted Mar 20, 2012·5 cites·22 claims
- 4564US7876593B2LED chip package structure with an embedded ESD function and method for manufacturing the sameHARVATEK CORP·Filed 2008·Granted Jan 25, 2011·2 cites·10 claims
- 4664US7142181B2Circuit board for large screen LED matrix array displayHARVATEK CORP·Filed 2003·Granted Nov 28, 2006·4 cites·2 claims
- 4764US6262481B1Folded heat sink for semiconductor device packageHARVATEK CORP·Filed 2000·Granted Jul 17, 2001·11 cites·6 claims
- 4863US7737635B2High efficiency white light emitting diode and method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Jun 15, 2010·2 cites·6 claims
- 4962US8198800B2LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameWANG BILY·Filed 2008·Granted Jun 12, 2012·2 cites·3 claims
- 5062US7662661B2Method of manufacturing a substrate structure for increasing cutting precision and strength thereofHARVATEK CORP·Filed 2005·Granted Feb 16, 2010·1 cites·5 claims
Showing the top 50 of 183 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →