Inventor · disambiguated record
Bingchien Wu
Also filed as: WU BINGCHIEN
3 granted patents·2 pending applications·2 citations·filing 2021–2025
58Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0192US11908843B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 0286US2025329695A1Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0386US2025336899A1Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0482US12406970B2Semiconductor package and method of bonding workpiecesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0582US12381191B2Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →