Inventor · disambiguated record
Bingsen Xie
Also filed as: Xie Bingsen
8 granted patents·2 citations·filing 2014–2022
73Inventor score
Top patents by PatentIndex Score
8 records- 0191US12302508B2Temporary carrier and method for manufacturing coreless substrate therebyZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 13, 2025·2 cites·8 claims
- 0264US11399440B2Method for manufacturing coreless substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·6 claims
- 0359US12476230B2Embedded packaging structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·7 claims
- 0458US11257713B2Interposer board without feature layer structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·17 claims
- 0551US11942465B2Embedded structure, manufacturing method thereof and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·8 claims
- 0650US11342273B2Package structure of integrated passive device and manufacturing method thereof, and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted May 24, 2022·0 cites·7 claims
- 0747US12074115B2Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Aug 27, 2024·0 cites·10 claims
- 0833US9852734B1Systems and methods for time-scale modification of audio signalsSYNAPTICS INC·Filed 2014·Granted Dec 26, 2017·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →