Inventor · disambiguated record
Bi Yi
Also filed as: YI BI
4 granted patents·4 pending applications·1 citations·filing 2014–2023
55Inventor score
Files withZTE CORP8
Top patents by PatentIndex Score
8 records- 0156US10064271B2PCB processing method and PCBZTE CORP·Filed 2014·Granted Aug 28, 2018·1 cites·10 claims
- 0248US12389533B2Printed circuit boardZTE CORP·Filed 2023·Granted Aug 12, 2025·0 cites·10 claims
- 0345US2023400635A1Optical-electronic printed circuit board, parameter determination method, electronic device, and storage mediumZTE CORP·Filed 2021·Application pending·0 cites
- 0443US2025323435A1Cable assembly, circuit board, connecting structure and electronic deviceZTE CORP·Filed 2023·Application pending·0 cites
- 0540US11696399B2Circuit boardZTE CORP·Filed 2020·Granted Jul 4, 2023·0 cites·7 claims
- 0640US11457529B2Circuit board, apparatus and method for forming via hole structureZTE CORP·Filed 2019·Granted Sep 27, 2022·0 cites·14 claims
- 0738US2024388020A1Cable Connection Structure, Cable Connection Component, and Electrical Interconnection SystemZTE CORP·Filed 2022·Application pending·0 cites
- 0837US2022369451A1Circuit board and communication deviceZTE CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →