Inventor · disambiguated record
Blanka Magyari-Kope
Also filed as: MAGYARI-KOPE BLANKA
6 granted patents·5 pending applications·6 citations·filing 2021–2025
73Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11
Top patents by PatentIndex Score
11 records- 0195US11621337B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·4 cites·20 claims
- 0294US12040377B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0382US12408413B2Semiconductor device, ferroelectric capacitor and laminated structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0474US2025311235A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0571US2025248046A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0669US12289893B2Semiconductor devices including FTJ structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 0767US12336186B2Semiconductor devices having ferroelectric tunnel junction structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0867US2024347633A1Interfacial dual passivation layer for a ferroelectric device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025079314A1Interconnect structure including conductive feature with low contact resistivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1056US2025054810A1Semiconductor structure including cap layer of two-dimensional material and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1155US12051749B2Interfacial dual passivation layer for a ferroelectric device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →