Inventor · disambiguated record
Bong-Su Ahn
Also filed as: AHN BONG S · AHN BONG-SU
7 granted patents·10 pending applications·59 citations·filing 2005–2019
80Inventor score
Top patents by PatentIndex Score
17 records- 0194US7261621B2Pad conditioner for chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 28, 2007·52 cites·23 claims
- 0272US9458280B2Polishing pad compoundSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 4, 2016·1 cites·8 claims
- 0371US9333467B2Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 10, 2016·2 cites·15 claims
- 0466US7402261B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 22, 2008·2 cites·23 claims
- 0564US7578727B2Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 25, 2009·2 cites·24 claims
- 0660US11541504B2Recycled polishing padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 0754US8007676B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·0 cites·15 claims
- 0848US2008045020A1Slurry Composition For a Chemical Mechanical Polishing Process, Method of Polishing an Object Layer and Method of Manufacturing a Semiconductor Memory Device Using the Slurry CompositionKIM NAM-SOO·Filed 2007·Application pending·0 cites
- 0948US2014364044A1Polishing pad and method of manufacturing the sameKPX CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1046US2013212951A1Polishing pad and method of manufacturing the sameKPX CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1144US2011027996A1Slurry composition for a chemical mechanical polishing process, method of polishing an object layer and method of manufacturing a semiconductor memory device using the slurry compositionKIM NAM-SOO·Filed 2010·Application pending·0 cites
- 1244US2007281486A1Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1344US2009042494A1Pad conditioner of semiconductor wafer polishing apparatus and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1442US2007037486A1Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing padKANG KYOUNG-MOON·Filed 2006·Application pending·0 cites
- 1540US2006032147A1Method of preparing slurry composition for chemical mechanical polishingSO JAE-HYUN·Filed 2005·Application pending·0 cites
- 1640US2006032150A1Method for producing improved cerium oxide abrasive particles and compositions including such particlesSO JAE H·Filed 2005·Application pending·0 cites
- 1735US2015133039A1Polishing pad and method for manufacturing sameKPX CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →