Inventor · disambiguated record
Boaz Atias
Also filed as: ATIAS BOAZ
13 granted patents·6 pending applications·9 citations·filing 2019–2024
83Inventor score
Top patents by PatentIndex Score
19 records- 0193US11303379B1Communication between data centers using a multi-core fiberMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Apr 12, 2022·4 cites·18 claims
- 0292US11561352B2High density optical I/O inside a data center switch using multi-core fibersMELLANOX TECHNOLOGIES LTD·Filed 2020·Granted Jan 24, 2023·3 cites·8 claims
- 0384US11630369B2Generation of an optical PAM-4 signal in a Mach-Zehnder modulatorMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Apr 18, 2023·1 cites·19 claims
- 0482US11630274B2High-density optical communications using multi-core fiberMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Apr 18, 2023·1 cites·14 claims
- 0569US12392976B2Optoelectronic component and method of manufacturing an optoelectronic componentMELLANOX TECHNOLOGIES LTD·Filed 2022·Granted Aug 19, 2025·0 cites·23 claims
- 0662US12255439B2Light emitting silicon deviceMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Mar 18, 2025·0 cites·21 claims
- 0760US2025311147A1Modules, systems, and methods for cooling optics and copper packagesMELLANOX TECHNOLOGIES LTD·Filed 2024·Application pending·0 cites
- 0859US12289839B2Process for localized repair of graphene-coated lamination stacks and printed circuit boardsMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Apr 29, 2025·0 cites·17 claims
- 0957US12245360B2Power arrangement and cooling system for electronic devicesNVIDIA CORP·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1054US2024306287A1Efficient thermal management for vertical power deliveryMELLANOX TECHNOLOGIES LTD·Filed 2023·Application pending·0 cites
- 1153US12004308B2Process for laminating graphene-coated printed circuit boardsMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Jun 4, 2024·0 cites·34 claims
- 1250US11963309B2Process for laminating conductive-lubricant coated metals for printed circuit boardsMELLANOX TECHNOLOGIES LTD·Filed 2021·Granted Apr 16, 2024·0 cites·22 claims
- 1349US2024397604A1Graphene integrated core and associated methods for thermal management within printed circuit boardsNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1449US2024397636A1Method for integrating a copper-graphene laminate (cgl) in a multilayer pcb fabrication processNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1548US11621927B2Authentication and data lane controlMELLANOX TECHNOLOGIES LTD·Filed 2020·Granted Apr 4, 2023·0 cites·25 claims
- 1648US11378765B2Intra data center and inter data center links using dual-wavelength multimode/singlemode multi-core fiberMELLANOX TECHNOLOGIES LTD·Filed 2020·Granted Jul 5, 2022·0 cites·6 claims
- 1744US2023007789A1Process for applying a two-dimensional material to a target substrate post-laminationMELLANOX TECHNOLOGIES LTD·Filed 2021·Application pending·0 cites
- 1842US10855331B1Apparatuses and systems for improved copper connectionsMELLANOX TECHNOLOGIES LTD·Filed 2019·Granted Dec 1, 2020·0 cites·18 claims
- 1940US2021400817A1Method and apparatus for the post-manufacturing adjustment of the characteristic impedance of pcb traces carrying high-speed data signalsMELLANOX TECHNOLOGIES LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →