Inventor · disambiguated record
Bogdan Bankiewicz
Also filed as: BANKIEWICZ BOGDAN
2 granted patents·1 pending application·0 citations·filing 2018–2023
28Inventor score
Technology areasH10W
Files withALPHA ASSEMBLY SOLUTIONS INC3
Top patents by PatentIndex Score
3 records- 0171US12388042B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Aug 12, 2025·0 cites·15 claims
- 0250US2025201741A1Sinter ready multilayer wire/ribbon bond pads and method for die top attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 0349US11842974B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Dec 12, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →