Inventor · disambiguated record
Bob Benjamin Buckley
Also filed as: BUCKLEY BOB · BUCKLEY BOB BENJAMIN
11 granted patents·1 pending application·7 citations·filing 2019–2023
81Inventor score
Top patents by PatentIndex Score
12 records- 0190US11600588B1Superconducting bump bonds for quantum computing systemsGOOGLE LLC·Filed 2021·Granted Mar 7, 2023·2 cites·7 claims
- 0289US11152764B1Gratings for high power single mode laserFREEDOM PHOTONICS LLC·Filed 2019·Granted Oct 19, 2021·5 cites·30 claims
- 0376US12207407B2Overlap joint flex circuit board interconnectionGOOGLE LLC·Filed 2023·Granted Jan 21, 2025·0 cites·18 claims
- 0473US12218091B2Superconducting bump bonds for quantum computing systemsGOOGLE LLC·Filed 2023·Granted Feb 4, 2025·0 cites·16 claims
- 0569US11751333B2Overlap joint flex circuit board matingGOOGLE LLC·Filed 2021·Granted Sep 5, 2023·0 cites·17 claims
- 0663US12209866B2Atomic sensor systemMORRISON GORDON BARBOUR·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 0761US12082335B2Superconducting flex circuit boards having metal structures for improved interfacing characteristicsGOOGLE LLC·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 0860US12321822B2Quantum computing system having flex circuit boards for improved signal transmissionsGOOGLE LLC·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 0959US12353953B2Filter for laminated circuit assemblyGOOGLE LLC·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 1055US12361306B2T-joint connector for quantum computing systemsGOOGLE LLC·Filed 2021·Granted Jul 15, 2025·0 cites·20 claims
- 1155US11923628B2Butt joint flex circuit board interconnectionGOOGLE LLC·Filed 2021·Granted Mar 5, 2024·0 cites·23 claims
- 1250US2024183604A1Scalable Thermalization of Wiring and Attenuation of Signals for Quantum Devices within Quantum Computing SystemsGOOGLE LLC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →