Inventor · disambiguated record
Bo Hua Chen
Also filed as: CHEN BO · Chen bo hua
5 granted patents·2 pending applications·2 citations·filing 2017–2023
63Inventor score
Top patents by PatentIndex Score
7 records- 0187US11587809B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·2 cites·12 claims
- 0272US12112965B2Wafer supporting mechanism and method for wafer dicingADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 8, 2024·0 cites·17 claims
- 0352US2025183099A1Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0448US10580951B2Package structure for backlight moduleUNIFLEX TECH INC·Filed 2018·Granted Mar 3, 2020·0 cites·10 claims
- 0542US2023037117A1Method of manufacturing semiconductor structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 0640US11189518B2Method of processing a semiconductor waferADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 30, 2021·0 cites·14 claims
- 0725US10948689B2Large-aperture, high-pixel optical system and camera module used therebyGUANGDONG HONGJING OPTOELECTRONIC TECH INC·Filed 2017·Granted Mar 16, 2021·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Bo Hua Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →