Inventor · disambiguated record
Bo Chen
Also filed as: CHEN BO · CHEN BO-SYUN
6 granted patents·1 pending application·7 citations·filing 2016–2020
71Inventor score
Top patents by PatentIndex Score
7 records- 0189US10332862B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·6 cites·30 claims
- 0268US10991660B2Semiconductor package having high mechanical strengthALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Apr 27, 2021·1 cites·19 claims
- 0358US10840219B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 0447US11062969B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Jul 13, 2021·0 cites·4 claims
- 0546US10242926B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2016·Granted Mar 26, 2019·0 cites·19 claims
- 0642US11309233B2Power semiconductor package having integrated inductor, resistor and capacitorALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2020·Granted Apr 19, 2022·0 cites·18 claims
- 0737US2021082790A1Power semiconductor package having integrated inductor and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →