Inventor · disambiguated record
Bongju Cho
Also filed as: CHO BONGJU
16 granted patents·2 pending applications·13 citations·filing 2019–2024
88Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
Top patents by PatentIndex Score
18 records- 0192US11569175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·5 cites·20 claims
- 0290US12261105B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0386US11562966B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·1 cites·20 claims
- 0484US11569158B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0581US12021020B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·1 cites·20 claims
- 0677US2024347468A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0776US11329014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·2 cites·16 claims
- 0876US11121079B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 0975US12046562B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1074US12394708B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1166US12119305B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 1264US11935847B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·18 claims
- 1363US11837537B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1458US12278191B2Semiconductor packages having wiring patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·19 claims
- 1553US2024222284A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1652US12057380B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·17 claims
- 1751US11721620B2Fan-out type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·19 claims
- 1850US11398420B2Semiconductor package having core member and redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Bongju Cho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →