Inventor · disambiguated record
Bongwoo Choi
Also filed as: CHOI BONGWOO
9 granted patents·32 citations·filing 2018–2024
85Inventor score
Files withSTATS CHIPPAC PTE LTD9
Top patents by PatentIndex Score
9 records- 0195US11935840B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·2 cites·23 claims
- 0295US11444035B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 13, 2022·3 cites·25 claims
- 0395US10784210B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2018·Granted Sep 22, 2020·11 cites·21 claims
- 0493US10985109B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 20, 2021·10 cites·25 claims
- 0592US11784133B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 10, 2023·2 cites·25 claims
- 0689US10910322B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 2, 2021·4 cites·19 claims
- 0784US12211804B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2024·Granted Jan 28, 2025·0 cites·25 claims
- 0882US12341108B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·13 claims
- 0966US11728281B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 15, 2023·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →