Inventor · disambiguated record
Bong Woo Choi
Also filed as: CHOI BONG WOO
3 granted patents·5 pending applications·0 citations·filing 2016–2025
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0170US2025391802A1Spacers for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0262US12406957B2Spacers for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 2, 2025·0 cites·19 claims
- 0356US12482781B2Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0456US2025054882A1Semiconductor device with an inductive coatingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0554US2024282733A1Semiconductor device with delamination reduction mechanism and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0648US2024145422A1Liquid-repelling coating for underfill bleed out controlMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0744US12506061B2Embedded trace substrate assemblies, and related microelectronic device assemblies, electronic systems, and processesMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·18 claims
- 0829US2017069565A1Integrated circuit packaging system with single-layer support structureSTATS CHIPPAC PTE LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →