Inventor · disambiguated record
Bo Mook Chung
Also filed as: CHUNG BO MOOK
5 granted patents·5 pending applications·1 citations·filing 2011–2023
61Inventor score
Top patents by PatentIndex Score
10 records- 0173US12495494B2Metal foil, carrier with metal foil comprising the same and printed circuit board including the sameYMT CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·7 claims
- 0258US2024174812A1Leveling agent and electroplating composition for forming circuit pattern including the sameYMT CO LTD·Filed 2022·Application pending·0 cites
- 0357US2025031316A1Methods for forming circuit pattern on substrate using metal foil with low surface roughnessYMT CO LTD·Filed 2023·Application pending·0 cites
- 0455US12408279B2Release layer for metal foil with carrier and metal foil comprising the sameYMT CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·8 claims
- 0550US11499233B2Plated laminate and printed circuit boardYMT CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·6 claims
- 0649US12139811B2Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the sameYMT CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·3 claims
- 0748US2024133039A1Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Application pending·0 cites
- 0844US2023203693A1Surface modifier for electrolytic nickel plating and nickel electroplating solution including the sameYMT CO LTD·Filed 2021·Application pending·0 cites
- 0941US9249319B2Liquid additive for etching silicon nitride and silicon oxide layers, metal ink containing the same, and method of manufacturing silicon solar cell electrodesHUH JOO-YOUL·Filed 2011·Granted Feb 2, 2016·0 cites·15 claims
- 1041US2024260200A1Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminateYMT CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →