Inventor · disambiguated record
Bo Guan
Also filed as: GUAN BO
3 granted patents·4 pending applications·0 citations·filing 2019–2024
39Inventor score
Top patents by PatentIndex Score
7 records- 0148US2025370422A1Method for obtaining different addresses by changing internal logic values of chip through lightSHENZHEN HSG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0246US12219713B1PCB arrangement and wiring structure of LED lamp beadsSHENZHEN HSG ELECTRONICS CO LTD·Filed 2024·Granted Feb 4, 2025·0 cites·10 claims
- 0344US11405489B2Method and apparatus for determining quality of service, and storage mediumHUAWEI TECH CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 0443US2024163994A1Lamp bead structure encapsulating led driver ics connected in parallelGUAN BO·Filed 2024·Application pending·0 cites
- 0542US2025372331A1Led lamp bead chip with dual-fuse structure and programming method thereofSHENZHEN HSG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0639US11283555B2Packet transmission method, network component, and computer-readable storage mediumHUAWEI TECH CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 0734US2019328237A1Device and method for monitoring skin temperature and conductanceUNIV CITY NEW YORK RES FOUND·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →