Inventor · disambiguated record
Bo-Huan Hsin
Also filed as: HSIN BO-HUAN
0 granted patents·7 pending applications·0 citations·filing 2023–2025
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
Top patents by PatentIndex Score
7 records- 0168US2025366198A1Semiconductor device structure for chip identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0259US2025056876A1Semiconductor device structure for chip identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0349US2025070059A1Connector height uniformity over under bump metal (ubm)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0446US2024405127A1Semiconductor device capable of releasing process charge, and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0546US2024405126A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0645US2025028893A1Optimized cell layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0744US2024387304A1Integrated Circuit Packages and MethodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →