Inventor · disambiguated record
Bo-Shiung Huang
Also filed as: HUANG BO-SHIUNG
3 granted patents·16 citations·filing 2012–2014
57Inventor score
Top patents by PatentIndex Score
3 records- 0183US9743523B2Printed circuit board package structure and manufacturing method thereofTRIPOD TECH CORP·Filed 2014·Granted Aug 22, 2017·16 cites·26 claims
- 0237US9258888B2Printed circuit board package structure and manufacturing method thereofTRIPOD TECHNOLOGY CORP·Filed 2014·Granted Feb 9, 2016·0 cites·18 claims
- 0331US9101072B2Method of embedding magnetic component in substrateHUANG BO-SHIUNG·Filed 2012·Granted Aug 4, 2015·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →