Inventor · disambiguated record
Bonggyu Kang
Also filed as: KANG BONGGYU
4 granted patents·1 pending application·0 citations·filing 2021–2025
53Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0166US2025385227A1Electronic device including thermal interface material layer and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0261US12283576B2Electronic device including thermal interface material layer and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0353US11982707B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0451US12347795B2Semiconductor package including uneven structures and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·21 claims
- 0549US11650237B2Method of manufacturing an integrated circuit involving performing an electrostatic discharge test and electrostatic discharge test system performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →