Inventor · disambiguated record
Bongjin Kuh
Also filed as: KUH BONGJIN
12 granted patents·4 pending applications·10 citations·filing 2008–2024
82Inventor score
Top patents by PatentIndex Score
16 records- 0183US12464727B2Ferroelectric memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·1 cites·20 claims
- 0279US10822694B2Substrate processing apparatus and method of cleaning the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 3, 2020·3 cites·20 claims
- 0377US9957617B2Deposition system for forming thin layerKUH BONGJIN·Filed 2016·Granted May 1, 2018·6 cites·18 claims
- 0466US12484261B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 0560US11854864B2Semiconductor device including trench isolation layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·16 claims
- 0657US2025374651A1Semiconductor device including a complementary field-effect transistor (cfet) having vertically stacked channel layersSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0756US2024395615A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0853US12310075B2Integrated circuit devices including vertically stacked field effect transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·19 claims
- 0951US11211284B2Semiconductor device including trench isolation layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·18 claims
- 1049US2023317811A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1145US9537029B2Semiconductor device with an epitaxial layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 3, 2017·0 cites·19 claims
- 1244US9443932B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 13, 2016·0 cites·12 claims
- 1339US10607832B2Method and apparatus for forming a thin layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·0 cites·18 claims
- 1436US9728666B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 8, 2017·0 cites·36 claims
- 1536US8105930B2Method of forming dielectric including dysprosium and scandium by atomic layer deposition and integrated circuit device including the dielectric layerCHOI HOONSANG·Filed 2008·Granted Jan 31, 2012·0 cites·23 claims
- 1629US2016126119A1Laser annealing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →