Inventor · disambiguated record
Bo Yeon Lee
Also filed as: LEE BO Y · LEE BO YEON
3 granted patents·1 pending application·22 citations·filing 1991–2023
59Inventor score
Top patents by PatentIndex Score
4 records- 0156US12385142B2Etchant composition for titanium-containing metal layer and etching method using the sameENF TECHNOLOGY CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 0255US5221039ALiquid phase diffusion bonding using high diffusivity element as insert materialKOREAN INST OF MACHINERY AND M·Filed 1991·Granted Jun 22, 1993·22 cites·4 claims
- 0342US2023303925A1Etchant composition of titanium layer and etching method using the sameENF TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0441US12023923B2Droplet ejection apparatus and droplet ejection method using the sameKOREA INST MACH & MATERIALS·Filed 2020·Granted Jul 2, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →