Inventor · disambiguated record
Bong-Hui Lee
Also filed as: LEE BONG-HUI
2 granted patents·3 pending applications·33 citations·filing 2001–2007
62Inventor score
Files withSAMSUNG TECHWIN CO LTD4
Top patents by PatentIndex Score
5 records- 0167US7119285B2Flexible printed circuit boardSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Oct 10, 2006·17 cites·10 claims
- 0267US6838753B2Lead-frame strip and method of manufacturing semiconductor packages using the sameSAMSUNG TECHWIN CO LTD·Filed 2002·Granted Jan 4, 2005·16 cites·13 claims
- 0336US2007200214A1Board strip and method of manufacturing semiconductor package using the sameSAMSUNG TECHWIN CO LTD·Filed 2007·Application pending·0 cites
- 0435US2003030131A1Semiconductor package apparatus and methodSAMSUNG TECHWIN CO LTD·Filed 2002·Application pending·0 cites
- 0533US2002037604A1Lead frame, semiconductor package having lead frame, and method of manufacturing semiconductor packageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →